Soldering Profiles

Venkel's Recommended Soldering Profiles

Soldering conditions are affected by mounting and PCB parameters. Please take these factors into account when using these solder profiles. These are recommendations only and no guarantees are implied by them.

Component Testing After Reflow/Rework For MLCC's:

All component testing after reflow/rework should be performed after ≥ 24hrs to ensure accurate capacitance value measurements. Capacitors should be cooled at room temperature for a minimum of 24 hours to allow the ceramic material to reset (age).

MSL Level

MSL (Moisture Sensitivity Level) is 1

Recommended soldering condition (reference)

  1. Re-flow soldering
    1. Recommended condition of Tin (Sn) solder
      Tin Soldering Profile
    2. Recommended condition of Tin-Lead (Sn-Pb) solder
      Tin/Lead Profile
  2. Flow soldering (Recommended condition of Tin (Sn) solder and Tin-Lead (Sn-Pb) solder)
    Flow Soldering